Sentiment Analysis on Marketplace in Indonesia using Support Vector Machine and Naïve Bayes Method

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DOI:

https://doi.org/10.26555/jiteki.v10i1.28070

Keywords:

Marketplace, Naïve Bayes, Sentiment Analysis, Support Vector Machine

Abstract

This research addresses the challenges of marketplace customer feedback, which is an important aspect in today's era of online transactions. Marketplaces often receive many unsatisfactory comments from their customers through social media platforms. One approach that can be used to address this is sentiment analysis. This research contributes new insights as recommendations for marketplaces based on customer opinions on available services and delivery. The sentiment analysis methods used are Naive Bayes and Support Vector Machine because they are considered the best methods in training text-based classification models. Before being classified, the data goes through preprocessing stages such as cleaning, case folding, filtering, stemming, and tokenizing, as well as feature extraction stages using Term Frequency - Inverse Document Frequency (TF-IDF). The objects analyzed are divided into several well-known marketplaces in Indonesia such as Tokopedia, Lazada, and Shopee in discussing services and delivery of goods. The data used in this study comes from Twitter (X) social media accessed on August 27, 2023, using crawling techniques and successfully obtained as much as 2057 Tweet data. The best accuracy is obtained in the SVM method when compared to the Naive Bayes method. Words obtained based on service talks include price, service, application service, feedback, independence, and others. As for the delivery of goods, common words such as COD, delivery, package, courier, cheap, price, and others appear. Both methods used have good accuracy and can be recommended for use in similar research.

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Published

2024-02-16

How to Cite

[1]
M. M. Dakwah, A. A. Firdaus, F. Furizal, and R. Faresta, “Sentiment Analysis on Marketplace in Indonesia using Support Vector Machine and Naïve Bayes Method”, J. Ilm. Tek. Elektro Komput. Dan Inform, vol. 10, no. 1, pp. 39–53, Feb. 2024.

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