Review of Peer-to-Peer (P2P) Lending Based on Blockchain

Authors

  • Timotius Victory Universitas Indonesia
  • Setiadi Yazid Universitas Indonesia

DOI:

https://doi.org/10.26555/jiteki.v9i4.27671

Keywords:

Financial Technology, Blockchain Technology, P2P Lending, Peer-to-Peer Lending

Abstract

Peer-to-Peer (P2P) lending is a financing business model that has gained popularity in recent years due to the ease of loan application, disbursement, and repayment processes. The volume of Peer-to-Peer (P2P) Lending transactions have a significant growth. One of the reasons for the popularity of Peer-to-Peer (P2P) lending is its utilization of technology in both the application and loan repayment processes. One such technology gaining traction in Peer-to-Peer (P2P) lending is blockchain technology. The popularity of blockchain technology lies in its ability to enhance the transparency of the transaction process. This literature study aims to address three main questions: What are the characteristics of blockchain suitable for Peer-to-Peer (P2P) lending , the benefits of implementing blockchain technology in Peer-to-Peer (P2P) lending and the challenges of Peer-to-Peer (P2P) lending based on blockchain. The findings reveal that there are characteristics of blockchain that can be applied to Peer-to-Peer (P2P) lending, bringing numerous benefits to the overall Peer-to-Peer (P2P) lending process. However, challenges persist in the implementation of blockchain technology in Peer-to-Peer (P2P) lending. The insights gained from this literature review are intended to guide researchers interested in studying the application of blockchain technology in the context of Peer-to-Peer (P2P) lending.

Author Biographies

Timotius Victory, Universitas Indonesia

Faculty of Computer Science, Universitas Indonesia

Setiadi Yazid, Universitas Indonesia

Faculty of Computer Science, Universitas Indonesia

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Published

2024-01-03

How to Cite

[1]
T. Victory and S. Yazid, “Review of Peer-to-Peer (P2P) Lending Based on Blockchain”, J. Ilm. Tek. Elektro Komput. Dan Inform, vol. 9, no. 4, pp. 1154–1167, Jan. 2024.

Issue

Vol. 9 No. 4 (2023): December

Section

Articles

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