A Miniaturized In Situ Tensile Platform under Microscope

Zhichao Ma Zhichao Ma, Hongwei Zhao, Hu Huang Hu Huang, Kaiting Wang, Qinchao Li Qinchao Li, Xiaoqin Zhou, Xiaoli Hu Xiaoli Hu

Abstract


Aiming at the mechanical testing of three-dimensional specimens with feature size of centimeter level, a miniaturized tensile platform, which presents compatibility with scanning electron microscope (SEM) and metallographic microscope, was designed and built. The platform could accurately evaluate the parameters such as elastic modulus, elongation and yield limit, etc. The calibration experiments of load sensor and displacement sensor showed the two kinds of sensors had high linearity. Testing of transmission error and modal parameters showed that the platform presented good following behaviors and separation of resonance region. Comparison tests based on stress-strain curve were carried out between the self-made platform and the commercial tensile instrument (Instron) to verify the feasibility of the platform. Furthermore, the in situ tensile experiment under metallographic microscope was carried out on a kind of manganese steel.

Full Text:

PDF

References


Neelakantan L, Schönberger B, Eggeler G, Hassel, A W. An in situ tensile tester for studying electrochemical repassivation behavior: Fabrication and challenges. Review of Scientific Instruments. 2010; 81(3).

Bettles C J, Lynch P A, Stevenson A W, Tomus D, Gibson M A, Wallwork K, Kimpton J. In situ observation of strain evolution in Cp-Ti over multiple length scales. Physical Metallurgy and Materials Science. 2011; 42: 100-110.

Zhang D Q, Chu J G, Hou Z W, Wang L D. An off-chip actuated tensile test device for microscale mechanical testing. Chinese Journal of Mechanical Engineering. 2009; 20.

Nishino T, Hirao K, Kotera M, Nakamae K, Inagaki H. Kenaf reinforced biodegradable composite. Composites Science and Technology. 2003; 63: 1281–1286.

Bamberg E, Grippo C P, Wanakamol P, Slocum A H, Boyce M C, Thomas E L. A tensile test device for in situ atomic force microscope mechanical testing. Precision Engineering. 2006; 30: 71-84.

Tu H, Cheng J, Chang Q, Zhou Q, Wang J, Zhang G, Fang F. Growth and stress analysis of necks for 300 mm CZ silicon single crystals. Microelectronic Engineering. 2001; 56: 89-92.

Aboulfaraj M, G'Sell C, Ulrich B. In situ observation of the plastic deformation of polypropylene spherulites under uniaxial tension and simple shear in the scanning electron microscope. Polymer. 1995; 36: 731-742.

Rizzieri R, Mahadevan L, Vaziri A, et al. Superficial wrinkles in stretched, drying gelatin films. Langmuir. 2006; 22: 3622-3626.

Rizzieri R, Baker F S, Donald A M. A tensometer to study strain deformation and failure behavior of hydrated systems via in situ environmental scanning electron microscopy. Review of Scientific Instruments. 2003; 74: 4423-4428.

Stokes D J, Donald A M. In situ mechanical testing of dry and hydrated breadcrumb in the environmental scanning electron microscope (ESEM). Journal of Materials Science. 2000; 35: 599-607.




DOI: http://dx.doi.org/10.12928/telkomnika.v10i3.832

Article Metrics

Abstract view : 162 times
PDF - 161 times

Refbacks

  • There are currently no refbacks.


Copyright (c) 2019 Universitas Ahmad Dahlan

Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

TELKOMNIKA Telecommunication, Computing, Electronics and Control
ISSN: 1693-6930, e-ISSN: 2302-9293
Universitas Ahmad Dahlan, 4th Campus, 9th Floor, LPPI Room
Jl. Ringroad Selatan, Kragilan, Tamanan, Banguntapan, Bantul, Yogyakarta, Indonesia 55191
Phone: +62 (274) 563515, 511830, 379418, 371120 ext. 4902, Fax: +62 274 564604

Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

View TELKOMNIKA Stats